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基于MEFAB工艺的平面集成高选择性W波段带通滤波器
Planar-Integrated High-Selectivity W-Band Bandpass Filter Using MEFAB Process
| 作者 | Song-Yao Ji · Jin Xu · Shi-Xin Meng · Zi-Hao Zhou · Hui-Kun Yang · Jia-Hao Zhao · Cheng-Lin Mou |
| 期刊 | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| 出版日期 | 2025年7月 |
| 卷/期 | 第 16 卷 第 2 期 |
| 技术分类 | 拓扑与电路 |
| 技术标签 | 宽禁带半导体 有限元仿真 功率模块 多物理场耦合 |
| 相关度评分 | ★★ 2.0 / 5.0 |
| 关键词 |
语言:
中文摘要
本文提出一种基于矩形微同轴线(RμCL)过渡结构的W波段高选择性平面集成带通滤波器,采用级联四重态拓扑实现四个传输零点;过渡结构插入损耗分别优于0.7 dB和1.1 dB;器件通过MEFAB工艺制造,体积小、稳定性好。
English Abstract
In this article, a design method of planar-integrated high-selectivity W-band bandpass filter (BPF) is proposed. A rectangular microcoaxial line (R $\mu $ CL)-to-surface-mounted-technology (SMT) transition and an R $\mu $ CL-to-grounded coplanar waveguide (CPWG) transition are designed for BPF’s planar integration. The two proposed transitions have low insertion loss (IL) in the W band and the R $\mu $ CL-to-CPWG transition has good structural stability by support cube under the inner conductor. The proposed BPF uses a cascaded quadruplet (CQ) topology and has signal interference paths between source and load, which will introduce four transmission zeros (TZs). The proposed transitions and BPFs are fabricated by microstructure electrochemical fabrication (MEFAB) process. The measured results show that the proposed R $\mu $ CL-to-SMT transition and R $\mu $ CL-to-CPWG transition have the IL better than 0.7 and 1.1 dB, respectively. The BPF using the above two transitions has the minimum IL of 1.1 and 1.4 dB, and the size of $2.456\times 2.302\times 0.9$ mm3 and $4.192\times 2.313\times 0.9$ mm3, respectively.
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SunView 深度解读
该文聚焦W波段高频微波滤波器设计与MEFAB微加工工艺,属于毫米波射频前端技术,与阳光电源主营业务(光伏逆变器、储能PCS、风电变流器等中低频功率变换设备)无直接关联。其高频互连与精密微结构工艺对阳光电源当前产品线影响极小;但长期看,若公司拓展智能运维雷达传感、无线状态监测或下一代SiC/GaN驱动芯片的EMI滤波集成封装,可借鉴其三维过渡结构设计与多物理场协同仿真方法。建议暂不投入资源,仅作前沿工艺跟踪。