High-Q MEMS Resonant Differential Pressure Sensor Using Wafer-Level Through-Glass-Via Packaging to Surmount Anodic Bonding Limitations

Jiayin Li · Gonghan He · Hui Liu · Zhiyin Cheng 等7人 · IEEE Electron Device Letters · 2025年12月 · Vol.47

This letter introduces a high-performance MEMS resonant differential pressure sensor with a dual-diaphragm coupled structure, designed for enhanced accuracy in aerospace and industrial applications. Traditional anodic bonding fails due to electrical ...