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功率器件技术 SiC器件 功率模块 多物理场耦合 热仿真 ★ 5.0

耦合寄生电感矩阵对角化及碳化硅功率模块动态均流等效建模

Diagonalisation of Coupled Parasitic Inductance Matrix and Equivalent Modelling for SiC Power Modules During Dynamic Current Sharing

作者 Xiaofeng Yang · Xuebao Li · Yongfan Zhan · Li Zhang · Rui Jin · Peng Sun · Xinling Tang · Zhibin Zhao
期刊 IET Power Electronics
出版日期 2026年2月
卷/期 第 19 卷 第 1 期
技术分类 功率器件技术
技术标签 SiC器件 功率模块 多物理场耦合 热仿真
相关度评分 ★★★★★ 5.0 / 5.0
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中文摘要

本文提出基于电路等效原理的耦合寄生电感矩阵(CPIM)解耦方法,通过矩阵对角化求解等效寄生电感(EPI),建立寄生电感网络模型,并结合芯片开关状态分析动态均流特性;验证了4芯片与6芯片并联模块EPI模型的理论与实验精度。

English Abstract

ABSTRACT The parasitic inductances of power loops in Silicon Carbide (SiC) power modules are critical parameters affecting dynamic current sharing, and their model can provide theoretical guidance for the design of dynamic current balancing. However, the coupled parasitic inductance matrix (CPIM) involved in the traditional model contains self‐inductances and complex coupled mutual inductances, which hinder direct quantitative evaluation of the parasitic inductance differences in the power loops of paralleled chips. Based on the circuit equivalence principle, this paper proposes a decoupling calculation method for the CPIM, which realises the solution and modelling of equivalent parasitic inductances (EPIs) by matrix diagonalisation. Combined with the switching states of chips, the current distribution characteristics in dynamic current sharing are clarified. Then, according to the concepts of partial self‐ and mutual inductance, the coupled parasitic inductance network model (CPINM) is developed. Based on the identical V – I characteristics of model circuits before and after decoupling, the CPIM is diagonalised to calculate the EPIs. Finally, the EPI models for actual 4‐chip and 6‐chip paralleled power modules are developed, and the accuracy of the models is verified by theoretical and experimental analysis.
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SunView 深度解读

该研究直接支撑阳光电源SiC基组串式逆变器(如SG3125HV系列)及ST系列储能PCS中高功率密度、高频开关下的芯片级动态均流设计。精准EPI建模可优化功率模块布局与叠层母排设计,降低换流振荡与电压过冲,提升系统可靠性与EMI性能。建议在PowerTitan液冷储能系统及下一代户用/工商业逆变器平台中集成该建模方法,用于热-电-磁多物理场协同仿真与失效前兆识别。