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功率器件技术 SiC器件 功率模块 热仿真 多物理场耦合 ★ 4.0

双芯片封装碳化硅肖特基势垒二极管的浪涌电流能力

Surge Current Capability of Dual-Chip Packaged SiC Schottky Barrier Diodes

作者 Bin Zhang · Hongliang Zhang · Zi'ang Zhao · Qiang Liu · Fanpeng Zeng · Yingxin Cui · Mingsheng Xu · Xiangang Xu · Handoko Linewih · Jisheng Han · Yu Zhong
期刊 Journal of Electronic Packaging
出版日期 2026年2月
卷/期 第 148 卷 第 3 期
技术分类 功率器件技术
技术标签 SiC器件 功率模块 热仿真 多物理场耦合
相关度评分 ★★★★ 4.0 / 5.0
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中文摘要

浪涌电流能力是SiC肖特基二极管在功率变换器中应用的关键参数。本文对比单芯片与双芯片封装SiC SBD的非重复浪涌电流能力,发现相同功率下双芯片方案更具优势;并基于电热耦合模型实现高精度预测(误差<2.8%),验证了模型工程适用性。

English Abstract

Abstract The surge current capability is one of the important key parameters for the application of silicon carbide (SiC) Schottky barrier diode (SBD) in power converters. A comparison is conducted between the surge current capability of single-chip packaged SiC SBD and dual-chip packaged SiC SBD. The result indicates that the dual-chip SBD with the same power has a higher nonrepetitive surge current limit. This article also focuses on the prediction of nonrepetitive surge current limits for dual-chip packaged SiC SBDs using an electrothermal model. The simulation and the actual device test results are matching well within 2.8% margin. Thus, it represents this simulation model that can be applied to predict the surge current capacity of the dual-chip packaged SiC SBD.
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SunView 深度解读

该研究直接支撑阳光电源组串式逆变器、ST系列PCS及PowerTitan储能系统中SiC功率模块的浪涌鲁棒性设计。双芯片封装结构可提升直流侧防雷/短路工况下的瞬态耐受能力,建议在下一代1500V+高压平台产品中优先导入该封装方案,并结合iSolarCloud平台集成电热模型实现实时寿命评估。