← 返回
双芯片封装碳化硅肖特基势垒二极管的浪涌电流能力
Surge Current Capability of Dual-Chip Packaged SiC Schottky Barrier Diodes
| 作者 | Bin Zhang · Hongliang Zhang · Zi'ang Zhao · Qiang Liu · Fanpeng Zeng · Yingxin Cui · Mingsheng Xu · Xiangang Xu · Handoko Linewih · Jisheng Han · Yu Zhong |
| 期刊 | Journal of Electronic Packaging |
| 出版日期 | 2026年2月 |
| 卷/期 | 第 148 卷 第 3 期 |
| 技术分类 | 功率器件技术 |
| 技术标签 | SiC器件 功率模块 热仿真 多物理场耦合 |
| 相关度评分 | ★★★★ 4.0 / 5.0 |
| 关键词 |
语言:
中文摘要
浪涌电流能力是SiC肖特基二极管在功率变换器中应用的关键参数。本文对比单芯片与双芯片封装SiC SBD的非重复浪涌电流能力,发现相同功率下双芯片方案更具优势;并基于电热耦合模型实现高精度预测(误差<2.8%),验证了模型工程适用性。
English Abstract
Abstract
The surge current capability is one of the important key parameters for the application of silicon carbide (SiC) Schottky barrier diode (SBD) in power converters. A comparison is conducted between the surge current capability of single-chip packaged SiC SBD and dual-chip packaged SiC SBD. The result indicates that the dual-chip SBD with the same power has a higher nonrepetitive surge current limit. This article also focuses on the prediction of nonrepetitive surge current limits for dual-chip packaged SiC SBDs using an electrothermal model. The simulation and the actual device test results are matching well within 2.8% margin. Thus, it represents this simulation model that can be applied to predict the surge current capacity of the dual-chip packaged SiC SBD.
S
SunView 深度解读
该研究直接支撑阳光电源组串式逆变器、ST系列PCS及PowerTitan储能系统中SiC功率模块的浪涌鲁棒性设计。双芯片封装结构可提升直流侧防雷/短路工况下的瞬态耐受能力,建议在下一代1500V+高压平台产品中优先导入该封装方案,并结合iSolarCloud平台集成电热模型实现实时寿命评估。