PCB热机械性能预测建模以实现可靠的叠层配置

Mismatches in printed circuit board (PCB) material properties can result in warping, cracks in copper vias/pads during solder reflow, and failures in thermal cycling tests (TCTs). Our proposed methodology, using material simulation software (Digimat), predicts the thermomechanical performance of PCB stack-ups. This approach enhances reliability by reducing warpage and failure modes, ensuring robust PCB performance. Both raw PCB materials (prepreg) and stack-ups with different resin types and glass styles are evaluated. Results indicate that simulation outcomes closely align with experimental stack-up results for all resin types (Resins A, B, and C), confirming the accuracy of the proposed approach. Based on material simulation and board-level stack-up experimental data, PCBs stacked with Resin type C exhibit a lower coefficient of thermal expansion (CTE) than the other resin types.