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一种具有自驱动电子积累层的新型4H-SiC/金刚石超结MOSFET,实现极低比导通电阻

A Novel 4H-SiC/Diamond SuperJunction MOSFET With Self-Driving Electron Accumulation Layer Realizing Extremely Low Ron,sp

作者 Bo Yi · JunFeng Duan · Qian Zhang · ShengNan Zhu · JunJi Cheng · HongQiang Yang · WenBo Luo
期刊 IEEE Electron Device Letters
出版日期 2025年11月
卷/期 第 47 卷 第 2 期
技术分类 功率器件技术
技术标签 SiC器件 宽禁带半导体 功率模块 有限元仿真
相关度评分 ★★★★ 4.0 / 5.0
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中文摘要

本文提出一种基于4H-SiC/金刚石超结结构并集成自驱动电子积累层(SD-EAL)的新型MOSFET,通过TCAD仿真验证其在1.6 kV耐压下比导通电阻低至0.75 mΩ·cm²,较传统超结降低36%,优值提升94%。

English Abstract

In this letter, a novel 4H-SiC/Diamond SuperJunction (SJ) MOSFET with a Self-driving Electron Accumulation Layer (SD-EAL) in the drift region, named as SD-EAL MOSFET, is proposed and investigated based on experimentally calibrated TCAD simulations. The SJ structure comprising n(4H-SiC)/Al2O3/p(Diamond) is used for feasible fabrication and formation of EAL. An integrated self-biased low-voltage power formed by integrated JFET structure, PolySi PN diode and MIS capacitor is designed to automatically drive the p-pillar, thus forming an EAL during on-state and significantly reducing the specific on-resistance (R ${}_{\mathbf {\textit {on},\textit {sp}}}$ ). The simulated breakdown voltage (BV) of the SD-EAL reaches ~1.6 kV, with R ${}_{\mathbf {\textit {on},\textit {sp}}}$ being only 0.75 m $\Omega\cdot $ cm ${}^{\mathbf {{2}}}$ , which is 36% lower than that of conventional SJ (C-SJ). Compared to the C-SJ MOSFET, Figure of Merit for the SD-EAL MOSFET reaches 5.69 GW/cm ${}^{\mathbf {{2}}}$ , which is improved by 94%. Thus, the SD-EAL can be an excellent candidate for future high-voltage SJ MOSFET.
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SunView 深度解读

该器件显著优化高压SiC功率模块的导通损耗与功率密度,可直接赋能阳光电源ST系列PCS、PowerTitan储能系统及组串式逆变器中主功率开关的升级换代。建议在下一代1500V+高压平台产品中开展SiC/金刚石复合超结器件的封装适配与可靠性验证,优先用于高功率密度户用及工商业光储一体机,以提升系统效率与散热性能。