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一种具有屏蔽孔路径以降低EMI噪声的新型沟槽型IGBT
A Novel Trench IGBT With Shielding Hole Path for Low EMI Noise
| 作者 | Tongyang Wang · Zehong Li · Yishang Zhao · Ziming Xia · Yige Zheng · Zhaoqing Jin · Wei Li · Xiaohan Liu |
| 期刊 | IEEE Transactions on Electron Devices |
| 出版日期 | 2026年3月 |
| 卷/期 | 第 73 卷 第 4 期 |
| 技术分类 | 功率器件技术 |
| 技术标签 | IGBT 功率模块 宽禁带半导体 可靠性分析 |
| 相关度评分 | ★★★★★ 5.0 / 5.0 |
| 关键词 |
语言:
中文摘要
本文提出并实验验证了一种带屏蔽孔路径(SHP)的新型沟槽型IGBT。SHP结构可抑制栅-集电极耦合、调控空穴输运,显著降低diC/dt和dVKA/dt,从而减少EMI噪声,且不牺牲其他电学性能。
English Abstract
A novel trench insulated gate bipolar transistor (IGBT) with shielding hole path (SHP) is proposed and experimentally demonstrated. During turn-on, the SHP shields the gate–collector coupling and provides a hole path (HP) near the main current path. A hole barrier is introduced near the gate trench to shield hole accumulation and form a hole depletion region. A hole well is introduced near the split-gate (SG) trench to enhance hole extraction through the SHP. Consequently, the displacement current that charges the gate electrode is effectively suppressed through the reduction of both the effective ${C}_{\text {GC}}$ for holes and $\textit {dV}_{\text {acc}}$ /dt. The experimental results show that, compared to the floating P-Region IGBT (FP-IGBT), the SHP-IGBT achieves a 49.0% lower $\textit {dI}_{\text {C}}$ /dt at the same ${R}_{\text {G}}$ and a 54.7% lower $\textit {dV}_{\text {KA}}$ / $\textit {dt}_{\max }$ at the same ${E}_{\text {on}}$ , reducing electromagnetic interference (EMI) noise without degrading other electrical parameters. In addition, a refined displacement current model incorporating the effective ${C}_{\text {GC}}$ for holes is proposed.
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SunView 深度解读
该SHP-IGBT技术可直接提升阳光电源组串式逆变器、ST系列PCS及PowerTitan储能系统的EMI兼容性与开关可靠性。在高频开关、高功率密度设计趋势下,该器件有助于降低滤波器体积与系统成本,增强弱电网环境下的并网稳定性。建议在下一代1500V组串式逆变器及2000V高压储能PCS中开展SHP-IGBT模块的封装适配与热-电协同验证,并结合iSolarCloud平台进行EMI特征在线监测算法开发。